Ankatek > SPG


PCB dimensions (mm) : L 50 x W 50 to L 510 x W 460

PCB exchange time : 6.5 s (incl. PCB recognition) (when PCB is L350 x W300 ) *1

Repeatability : 2Cpk ±5.0μm 6σ (±3σ)

Screen frame dimensions (mm) : L 736 x W 736, L 650 x W 550, L 600 x W 550*2

Features that enable high productivity and stable quality

Hybrid squeegee head

Hybrid squeegee head, which has a good track record with our highly functional models, is equipped as standard.
Together with stabilizing rolling solders, printing cycle time is reduced.

High-speed mask cleaning

New-type cleaning mechanism reduces paper consumption. Moreover, parallel processing of transfer and cleaning cuts back loss time.

3 conveyors equipped

3 conveyors are equipped as standard for shorter PCB exchange time.
(supported PCB length up to MAX 350mm)

Various options to realize productivity/quality improvement and labor savings

Perforated pot type automatic solder supply

Automation of solder supply allows for labor savings and uninterrupted operation.
Cleaning of spatulas/nozzles is unnecessary
・Reduction of discarded solder
e.g., solder attached on spatulas or inside nozzles
・Uninterrupted operation
2-pot-type continuous supply

Sealed head

Press-fit of solder becomes possible, allowing fine pitch/through hole printing.

PCB pickup blower (switch type)

Printing transcription is improved through the use of blower to create airflow pathways from metal mask to PCB.

One-touch support pins

Support unit for batch replacement.
While checking on PCB, you can set magnet pins at desired locations.

Automatic mask positioning

Based on PCB data, the Y-directional mask position is automatically registered.

2 Line solution

According to the correction data of shifted printing positions analyzed by solder paste inspection (APC correction data), it corrects printing positions(X ,Y ,θ).
*3D inspection equipment of other companies can also be connected.

* Please inquire with your sales representative for more details

Connect with upper system(LNB,LWS…)
• Automatic changeover
• Component verification(solder/mask/squeegee…)
• Trace data output