SPG

PCB dimensions (mm) : L 50 x W 50 to L 510 x W 460

PCB exchange time : 6.5 s (incl. PCB recognition) (when PCB is L350 x W300 ) *1

Repeatability : 2Cpk ±5.0μm 6σ (±3σ)

Screen frame dimensions (mm) : L 736 x W 736, L 650 x W 550, L 600 x W 550*2

Features that enable high productivity and stable quality

Hybrid squeegee head

Hybrid squeegee head, which has a good track record with our highly functional models, is equipped as standard.
Together with stabilizing rolling solders, printing cycle time is reduced.

High-speed mask cleaning

New-type cleaning mechanism reduces paper consumption. Moreover, parallel processing of transfer and cleaning cuts back loss time.

3 conveyors equipped

3 conveyors are equipped as standard for shorter PCB exchange time.
(supported PCB length up to MAX 350mm)

Various options to realize productivity/quality improvement and labor savings

Perforated pot type automatic solder supply

Automation of solder supply allows for labor savings and uninterrupted operation.
・Maintenance-free
Cleaning of spatulas/nozzles is unnecessary
・Reduction of discarded solder
e.g., solder attached on spatulas or inside nozzles
・Uninterrupted operation
2-pot-type continuous supply

Sealed head

Press-fit of solder becomes possible, allowing fine pitch/through hole printing.

PCB pickup blower (switch type)

Printing transcription is improved through the use of blower to create airflow pathways from metal mask to PCB.

One-touch support pins

Support unit for batch replacement.
While checking on PCB, you can set magnet pins at desired locations.

Automatic mask positioning

Based on PCB data, the Y-directional mask position is automatically registered.

Ｍ2Ｍ Line solution

According to the correction data of shifted printing positions analyzed by solder paste inspection (APC correction data), it corrects printing positions(X ,Y ,θ).
*3D inspection equipment of other companies can also be connected.

* Please inquire with your sales representative for more details

Connect with upper system(LNB,LWS…)
• Automatic changeover
• Component verification(solder/mask/squeegee…)
• Trace data output