ECORELTM FREE 0307-16 is a no clean lead-free solder paste combining the metallurgical properties and cost benefits of a low silver alloy with high performance chemistry of the ECORELTM range.
Very good wetting on any surface finish including OSP and strong anti-graping properties Robust assembly process for high volume electronics and complex boards
Outstanding first pass yield testability in ICT
Transparent and colorless residue even after multiple reflow cycles
Alloy : Sn99,Ag0.3,Cu0,7
Powder size distribution (microns) : 20-38
Melting point : 217-227
Metal content (%) : 88 0.5
Residue after reflow soldering (%) : 47 – 54
Halogen content : no halogen
Viscosity* (Pa.s at 20°C) : 800 – 1100