Mirtec MS11E 3D SPI

3D Inspection Technology

3D Inspection Technology : Shadow Free – Moiré 3D Phase Step Image Processing

Height Resolution : 0.1um

Height Accuracy : 2um

Height Repeatability : ±1%

Volume Repeatability : ±2%

Solder Height : Maximum 450um

Measurement Capability : Volume, Area, Height, X-Y Position, Bridge, Shape, Etc.

Image Transfer Technology

15 Mega Pixel Camera : CoaXPress 120fps

4 Mega Pixel Camera : Camera Link 180fps

System Specifications

Lens Configuration : Precision Telecentric Compound Lens Design

Laser PCB Warpage Compensation : 1um / Point

PCB Top Side Clearance : 25mm

PCB Bottom Side Clearance : 25mm (Option : 50.8mm)

Maximum PCB Warpage : ±3mm

Barcode Reader – Camera Type (Option) : 1D or 2D PCB Barcode Reading Capability Using Top-Down Camera

Built-in SPC : Statistical Process Control Software (Local)

Built-in Repair : Repair Plus Software (Local)

Resolution : 1um

Repeatability : ±10um

PCB Size Range : 50mm x 50mm to 510mm x 460mm