WSM 310

PCB Width : 30 to 300 mm

Board Handling : Fingers

Preheat Length : 870mm (34.25″)

Preheat Method : IR + Convection

Solder Pot Capacity : 90kgs single wave , 170 kgs double wave

Max. Solder Pot Temperature : 300°C (572°F)

Max. Conveyer Speed : 0.5 to 2.5 m / min / (98.4″/ min)

Foam Fluxer Tank : 3 liters (0.8 gal.)

System Features

• Finger conveyor far pallet-less operation
• Visibility throughout entire process with clear viewing.
• On load and off load conveyor extensions
• Durable, rugged welded steel frame construction
• Status light tower
• Fully dry wave, no oil intermix required
• Stainless steel solder pump impellers with external ball bearings
• Laminar wave far through hole component soldering
• Motorized conveyor width adjustment /solder pot rollout
• Fluxer and air knife pressure regulators
• Solder level sensor alarm
• Solder drain with stainless steel valve
• Lead-free solder capable