WSM 310

Ankatek > WSM 310

WSM 310

PCB Width : 30 to 300 mm

Board Handling : Fingers

Preheat Length : 870mm (34.25″)

Preheat Method : IR + Convection

Solder Pot Capacity : 90kgs single wave , 170 kgs double wave

Max. Solder Pot Temperature : 300°C (572°F)

Max. Conveyer Speed : 0.5 to 2.5 m / min / (98.4″/ min)

Foam Fluxer Tank : 3 liters (0.8 gal.)

System Features

  • Finger conveyor far pallet-less operation
  • Visibility throughout entire process with clear viewing.
  • On load and off load conveyor extensions
  • Durable, rugged welded steel frame construction
  • Status light tower
  • Fully dry wave, no oil intermix required
  • Stainless steel solder pump impellers with external ball bearings
  • Laminar wave far through hole component soldering
  • Motorized conveyor width adjustment /solder pot rollout
  • Fluxer and air knife pressure regulators
  • Solder level sensor alarm
  • Solder drain with stainless steel valve
  • Lead-free solder capable