PCB Width : 30 to 300 mm
Board Handling : Fingers
Preheat Length : 870mm (34.25″)
Preheat Method : IR + Convection
Solder Pot Capacity : 90kgs single wave , 170 kgs double wave
Max. Solder Pot Temperature : 300°C (572°F)
Max. Conveyer Speed : 0.5 to 2.5 m / min / (98.4″/ min)
Foam Fluxer Tank : 3 liters (0.8 gal.)
System Features
- Finger conveyor far pallet-less operation
- Visibility throughout entire process with clear viewing.
- On load and off load conveyor extensions
- Durable, rugged welded steel frame construction
- Status light tower
- Fully dry wave, no oil intermix required
- Stainless steel solder pump impellers with external ball bearings
- Laminar wave far through hole component soldering
- Motorized conveyor width adjustment /solder pot rollout
- Fluxer and air knife pressure regulators
- Solder level sensor alarm
- Solder drain with stainless steel valve
- Lead-free solder capable