Mirtec MV3L Offline 2D AOI

Top-Down View Camera

Top-Down View Camera : 10MP ISIS (3,664 x 2,736) Camera Option 1 : 10 Mega Pixels @ 18.2 um/pixel

Top-Down View Camera : 10MP ISIS (3,664 x 2,736) Camera Option 2 : 10 Mega Pixels @ 13.4 um/pixel

Top-Down View Camera : 10MP ISIS (3,664 x 2,736) Camera Option 3 : 10 Mega Pixels @ 9.8 um/pixel

SIDE-VIEWER® Camera System

Quantity Four – 10 Mega Pixel (3,664 x 2,736) Color Side Angle Cameras

INTELLI-BEAM® Laser Specifications

Z-Height Measurement Accuracy: +/- 20 um

Resolution : 15 um / point

Inspection Speed : 0.5 sec / point

Top-Down Camera Lens : Precision Telecentric Compound Lens Design

Top Side Clearance : 45mm (1.77”)

Bottom Side Clearance : 50.8mm (2.0”) From Bottom of PCB Surface

Minimum Component Inspection : 01005 Chip Component.

Robot Positioning System : Closed Loop AC Servo Drive System

Resolution : 6 um (.0000394 in.)

Repeatability : ±15 um (± 0.000394 in.)

Maximum Inspection Speed : 0.37sec / frame – 8.946 mm2 / sec (11.046 in2 / sec)

PCB Size Range : 50mm x 50mm to 500mm x 400mm (2.0” x 2.0” to 19.7” x 15.7”)