Mirtec MS15 3D SPI

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Mirtec MS15 3D SPI

3D Inspection Technology

3D Inspection Technology : Shadow Free – Moiré 3D Phase Step Image Processing

Height Resolution : 0.1um

Height Accuracy : 2um

Height Repeatability : ±1%

Volume Repeatability : ±2%

Solder Height : Maximum 450um

Measurement Capability : Volume, Area, Height, X-Y Position, Bridge, Shape, Etc.

Image Transfer Technology

25 Mega Pixel Camera : CoaXPress 72fps

15 Mega Pixel Camera : CoaXPress 120fps

System Specifications

Lens Configuration : Precision Telecentric Compound Lens Design

Laser PCB Warpage Compensation : 1um / Point

PCB Top Side Clearance : 45mm

PCB Bottom Side Clearance : 25mm (Option : 50.8mm)

Maximum PCB Warpage : ±3mm

Barcode Reader – Camera Type (Option) : 1D or 2D PCB Barcode Reading Capability Using Top-Down Camera

Built-in SPC : Statistical Process Control Software (Local)

Built-in Repair : Repair Plus Software (Local)

Resolution : 0,5um

Repeatability : ±2um

PCB Size Range : 50 mm x 50 mm to 510 mm x 460 mm (2.0″ x 2.0″ to 20.1″ x 18.1″)