3D Inspection Technology
3D Inspection Technology : Shadow Free – Moiré 3D Phase Step Image Processing
Height Resolution : 0.1um
Height Accuracy : 2um
Height Repeatability : ±1%
Volume Repeatability : ±2%
Solder Height : Maximum 450um
Measurement Capability : Volume, Area, Height, X-Y Position, Bridge, Shape, Etc.
Image Transfer Technology
25 Mega Pixel Camera : CoaXPress 72fps
15 Mega Pixel Camera : CoaXPress 120fps
System Specifications
Lens Configuration : Precision Telecentric Compound Lens Design
Laser PCB Warpage Compensation : 1um / Point
PCB Top Side Clearance : 45mm
PCB Bottom Side Clearance : 25mm (Option : 50.8mm)
Maximum PCB Warpage : ±3mm
Barcode Reader – Camera Type (Option) : 1D or 2D PCB Barcode Reading Capability Using Top-Down Camera
Built-in SPC : Statistical Process Control Software (Local)
Built-in Repair : Repair Plus Software (Local)
Resolution : 0,5um
Repeatability : ±2um
PCB Size Range : 50 mm x 50 mm to 510 mm x 460 mm (2.0″ x 2.0″ to 20.1″ x 18.1″)